With a goal of serving the design needs of small form-factor embedded systems, Silicon Labs is rolling out families of MCUs and wireless SoCs in tiny packages.
With these sizes, the devices are well suited for tiny, battery-optimized device designs. Examples include connected medical devices, wearables, asset monitoring tags, smart sensors, simple consumer electronics like toothbrushes and toys, and more.
In this article, we delve into the key specifications and features offered by these new devices.The xG27 family of SoCs comprises two ICs: the BG27, for Bluetooth connectivity, and the MG27, supporting Zigbee and other proprietary protocols. Both devices embed an Arm Cortex M33 CPU. The BG27 and MG27 also share a number of oher common features.
The two ICs are available in wafer-level Chip Scale Packaging (CSP) as small as 2.3 mm x 2.6 mm. This makes them well suited for small and unobtrusive device design, such as medical patches, continuous glucose monitors, wearable electrocardiograms, and asset tracking tags. The two wireless SoCs also feature an integrated DC-DC boost converter. This enables the ICs to run off batteries as low as 0.8 V.
Nomination Link : https://x-i.me/susnom
Registration Link: https://x-i.me/susreg2
#graphicdesign #webdesign #logodesign #productdesign #digitaldesign
No comments:
Post a Comment